GIGABYTE introduced its 40th anniversary special motherboards!

GIGABYTE introduced its 40th anniversary X870E and X870 AORUS INFINITY series motherboards as part of COMPUTEX 2026.

GIGABYTE introduced its 40th anniversary X870E and X870 AORUS INFINITY series motherboards as part of COMPUTEX 2026. The series developed for AMD Ryzen 9950X3D2 processors focuses on high-end gaming systems, content creation stations and desktop users aiming for high memory performance. Two models stand out in the new series: X870E AORUS INFINITY NEXT and X870 AORUS INFINITY. While the X870E AORUS INFINITY NEXT is positioned at the flagship level in terms of power distribution and cooling, the X870 AORUS INFINITY model is designed with the aim of lower memory latency and high response time.

Artificial Intelligence Supported Performance Tuning with X3D Turbo Mode 2.0 At the center of the series is GIGABYTE’s artificial intelligence supported overclocking technology, X3D Turbo Mode 2.0. This system monitors system operating conditions and workload behaviors in real time through the hardware chip on the motherboard. Working together with the dynamic OC engine, the structure uses performance optimization trained with big data.

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Thus, smarter and more adaptable performance adjustments can be made depending on the processor. This technology aims to manage performance more effectively in gaming, content production and systems operating under heavy load. 3D Printed Cooling Design in X870E AORUS INFINITY NEXTX870E AORUS INFINITY NEXT comes with a structure inspired by space technology and data center class components on the thermal design side. Rocket propellant class thermal materials and advanced 3D metal printing technology are used on the motherboard.

One of the striking components of the model is the AI Gyroid M.2 cooler structure. This structure, which can be produced with 3D metal printing, increases the cooling surface area by up to 44 percent. In addition, the 3D printed vapor chamber and honeycomb metal backplate aim to go beyond traditional motherboard cooling solutions. There are 64 power phases on the motherboard. With Low Earth Orbit and data center class Quad OptiMOS technology, a total current capacity of 5,120 amperes can be reached.

This structure aims for a stronger power distribution for high-performance Ryzen processors and systems operating under heavy load. Power infrastructure stands out especially in scenarios such as overclocking, long-term rendering operations and high-end gaming systems. The X870 AORUS INFINITY model is developed to increase memory responsiveness on the AMD X870 platform. The motherboard uses a structure that is twice as tight as standard timings, targeting the CL24 timing value.

According to GIGABYTE, this structure provides a 20 percent speed advantage and reaches the lowest memory latency value on the AMD X870 platform. This means a more responsive system experience, especially for gamers aiming for high FPS and applications sensitive to memory latency.

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