Summary in 10 SecondsMediaTek introduced the game-oriented Dimensity 7450 and foldable devices-specific Dimensity 7450X models with 4nm architecture. The new chipsets are equipped with high-end technical features such as 200MP camera support, Wi-Fi 6E connection and 3.27Gbps 5G speed. Thanks to the dual screen support offered by the Dimensity 7450X model, it is expected to be used in new generation foldable phones such as the Motorola Razr 70.
The expected move from MediaTek came and the company introduced two new chipsets that will stimulate the mid-upper segment smartphone market. These new hardware, named Dimensity 7450 and Dimensity 7450X, focus on foldable devices and mobile game enthusiasts, which have become increasingly popular lately. These models, which appeared quietly on the company’s official website on April 26, 2026, seem to power many ambitious devices that we will see on the shelves in the near future.
The first information from the industry shows that the Dimensity 7450X model will change the balance, especially in the vertical foldable (flip) phone market. In fact, strong rumors circulating in the technology world indicate that this processor may first appear in the highly anticipated Motorola Razr 70 model. This move by MediaTek will pave the way for foldable screen technology to become widespread not only in flagship devices, but also in the middle-upper segment, which appeals to a wider user base.
A new breath in the balance of gaming and productivity. Both processors come off the band with a 4nm class production process. This means that they aim to keep battery consumption to a minimum while offering high performance. On the processor side, an eight-core structure welcomes us. Four Cortex-A78 performance cores running at 2.6GHz are accompanied by four energy efficiency-oriented Cortex-A55. The graphics load is handled by the Arm Mali-G615 MC2 graphics unit.
Thanks to MediaTek’s HyperEngine and Adaptive Gaming Technology 3.0 features, it is aimed to prevent problems such as heating and performance decrease during gaming sessions. These technologies promise a fluent experience by dynamically managing hardware resources. Special touch for foldable phones 7450XSo, if you ask what the real detail that distinguishes the Dimensity 7450X model from the standard version is, the answer is hidden in the screen support.
MediaTek has optimized this chipset especially for dual-screen foldable devices. In this way, both the main screen inside and the cover screen outside of the device can be managed without any problems. This hardware support allows manufacturers to offer a more fluid and integrated user experience. The importance of this optimization is better understood, especially considering the importance that brands such as Motorola attach to cover screen functionality.
Dimensity 7450X also improves the performance of switching between screens, which is one of the biggest difficulties of foldable devices. Camera and artificial intelligence performance There are also pleasing details for photography enthusiasts. Thanks to the Imagiq 950 ISP image signal processor, these processors support camera sensors with up to 200MP resolution. In addition, the mobile photography experience is taken to the next level with 4K HDR video recording and Google Ultra HDR support.
On the artificial intelligence side, the sixth generation NPU comes into play. Offering 7 percent more performance than the previous generation, this unit both improves camera features and accelerates on-device artificial intelligence tasks. This new artificial intelligence engine is expected to make a difference, especially in processes such as noise reduction and object recognition in low light. Connection technologies and screen support For speed enthusiasts, there is a modem on the 5G side that can reach 3.27Gbps download speeds.
Wi-Fi 6E and Bluetooth 5.4 support also proves that current connection standards are fully presented. On the screen side, there is support for 120Hz refresh rate in WFHD resolution and 144Hz on Full HD panels. The chipsets offer LPDDR5 and LPDDR4X support at 6400Mbps on the memory side, and are compatible with up to the UFS 3.1 standard on the storage unit. These features provide an infrastructure that will allow even a mid-segment device to operate with flagship fluency.
Editor’s note These new chipsets from MediaTek can enable this technology to spread to the base, especially by reducing the costs in the foldable phone market. The dual screen support offered by the Dimensity 7450X model will bring the user experience of mid-segment foldable devices closer to the flagship level. How Qualcomm will respond to this move in the coming period is of critical importance in terms of intensifying competition in the sector.
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